Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,769
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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607
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,407
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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1,989
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-13-632-41-801000
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1,471
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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1,558
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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3,324
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,899
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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3,136
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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3,650
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,766
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,757
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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3,361
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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971
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,816
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-13-322-41-801000
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3,799
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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3,912
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,190
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,534
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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684
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-13-640-41-801000
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1,591
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-13-624-41-801000
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1,035
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-13-324-41-801000
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790
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-13-320-41-801000
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3,008
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-13-628-41-801000
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2,478
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-13-316-41-801000
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2,633
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-13-314-41-801000
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3,853
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-13-318-41-801000
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3,885
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 10.0µin (0.25µm) Brass Alloy