Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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1,125
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Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 652 (35 x 35) Beryllium Copper Brass
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RFQ
1,242
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 600 (35 x 35) Beryllium Copper Brass
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RFQ
1,343
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 576 (30 x 30) Beryllium Copper Brass
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RFQ
975
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 560 (33 x 33) Beryllium Copper Brass
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RFQ
1,172
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 272 (20 x 20) Beryllium Copper Brass
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RFQ
VIEW
RFQ
3,682
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 256 (16 x 16) Beryllium Copper Brass
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RFQ
VIEW
RFQ
1,409
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 256 (20 x 20) Beryllium Copper Brass
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RFQ
VIEW
RFQ
3,721
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 192 (16 x 16) Beryllium Copper Brass
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RFQ
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RFQ
3,064
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 360 (19 x 19) Beryllium Copper Brass
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RFQ
VIEW
RFQ
3,408
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 357 (19 x 19) Beryllium Copper Brass
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RFQ
VIEW
RFQ
2,235
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 356 (26 x 26) Beryllium Copper Brass
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RFQ
VIEW
RFQ
774
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 352 (26 x 26) Beryllium Copper Brass
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RFQ
VIEW
RFQ
1,145
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 10.0µin (0.25µm) 381 (18 x 18) Beryllium Copper Brass
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VIEW
RFQ
3,190
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 225 (18 x 18) Beryllium Copper Brass
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RFQ
VIEW
RFQ
1,857
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Tin - 381 (18 x 18) Beryllium Copper Brass
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RFQ
VIEW
RFQ
2,567
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Tin - 361 (18 x 18) Beryllium Copper Brass
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VIEW
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642
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 10.0µin (0.25µm) 361 (18 x 18) Beryllium Copper Brass
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RFQ
VIEW
RFQ
946
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 292 (20 x 20) Beryllium Copper Brass
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VIEW
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3,130
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 145 (15 x 15) Beryllium Copper Brass
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RFQ
3,235
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 241 (18 x 18) Beryllium Copper Brass
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VIEW
RFQ
846
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 121 (13 x 13) Beryllium Copper Brass
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RFQ
VIEW
RFQ
1,043
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin - 241 (18 x 18) Beryllium Copper Brass
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RFQ
VIEW
RFQ
3,963
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 149 (15 x 15) Beryllium Copper Brass
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RFQ
VIEW
RFQ
683
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 520 (31 x 31) Beryllium Copper Brass
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RFQ
VIEW
RFQ
3,270
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 504 (29 x 29) Beryllium Copper Brass
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RFQ
VIEW
RFQ
2,993
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 500 (30 x 30) Beryllium Copper Brass
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RFQ
VIEW
RFQ
3,231
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 480 (29 x 29) Beryllium Copper Brass
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RFQ
VIEW
RFQ
2,230
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 478 (26 x 26) Beryllium Copper Brass
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RFQ
VIEW
RFQ
3,276
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 456 (26 x 26) Beryllium Copper Brass
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RFQ
VIEW
RFQ
845
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 432 (31 x 31) Beryllium Copper Brass