Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,805
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,097
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,026
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,210
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,062
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,462
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,438
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,277
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,585
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 4POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 4 (2 x 2) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,127
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,455
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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759
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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674
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-83-648-41-001101
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3,927
In-stock
Preci-Dip CONN IC DIP SOCKET 48POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 48 (2 x 24) Beryllium Copper - Brass
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898
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 6POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-93-422-41-003000
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1,488
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-83-628-41-001101
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1,485
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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1,928
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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3,265
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
115-87-640-41-001101
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3,226
In-stock
Preci-Dip CONN IC DIP SOCKET 40POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 40 (2 x 20) Beryllium Copper - Brass
115-87-636-41-003101
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743
In-stock
Preci-Dip CONN IC DIP SOCKET 36POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 36 (2 x 18) Beryllium Copper - Brass
115-87-642-41-001101
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RFQ
2,850
In-stock
Preci-Dip CONN IC DIP SOCKET 42POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 42 (2 x 21) Beryllium Copper - Brass
115-83-624-41-003101
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RFQ
1,325
In-stock
Preci-Dip CONN IC DIP SOCKET 24POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper - Brass
115-83-424-41-003101
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RFQ
1,033
In-stock
Preci-Dip CONN IC DIP SOCKET 24POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper - Brass
115-83-324-41-003101
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914
In-stock
Preci-Dip CONN IC DIP SOCKET 24POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper - Brass
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1,883
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-87-636-41-001101
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2,826
In-stock
Preci-Dip CONN IC DIP SOCKET 36POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 36 (2 x 18) Beryllium Copper - Brass
115-83-624-41-001101
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RFQ
1,615
In-stock
Preci-Dip CONN IC DIP SOCKET 24POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper - Brass
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3,684
In-stock
Preci-Dip CONN IC DIP SOCKET 24POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper - Brass
115-83-324-41-001101
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2,566
In-stock
Preci-Dip CONN IC DIP SOCKET 24POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper - Brass