Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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2,031
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS TIN 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin - - 14 (2 x 7) Beryllium Copper Copper
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737
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 22 (2 x 11) Beryllium Copper Nickel
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760
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 20 (2 x 10) Beryllium Copper Beryllium Copper
6-1437536-3
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1,462
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 32 (2 x 16) Beryllium Copper Brass
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3,638
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 24 (2 x 12) Beryllium Copper Brass
2-1571550-8
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2,783
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 24 (2 x 12) Beryllium Copper Beryllium Copper
5-1571551-0
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RFQ
3,681
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 32 (2 x 16) Beryllium Copper Nickel
9-1437535-1
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946
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper Copper Alloy
2-1571550-3
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RFQ
2,428
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper Beryllium Copper
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866
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 40 (2 x 20) Beryllium Copper Beryllium Copper
5-1437536-2
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2,024
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 28 (2 x 14) Beryllium Copper Brass
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2,151
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 6 (2 x 3) Beryllium Copper Brass
540-AG10D-ES
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3,417
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 40 (2 x 20) Beryllium Copper Brass
4-1571551-3
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RFQ
2,317
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper Nickel
506-AG11D-ESL-LF
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2,006
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 6 (2 x 3) Beryllium Copper Nickel
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1,115
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 18 (2 x 9) Beryllium Copper Beryllium Copper
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2,317
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 36POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 36 (2 x 18) Beryllium Copper Nickel
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1,519
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 28 (2 x 14) Beryllium Copper Nickel
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2,695
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold 5.00µin (0.127µm) - 24 (2 x 12) Beryllium Copper Brass
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719
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 18 (2 x 9) Beryllium Copper Nickel
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3,316
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 40 (2 x 20) Beryllium Copper Nickel
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2,717
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) Tin-Lead 28 (2 x 14) Beryllium Copper Brass, Copper
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911
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 32 (2 x 16) Beryllium Copper Nickel
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1,477
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 18 (2 x 9) Beryllium Copper Nickel
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2,545
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 14 (2 x 7) Beryllium Copper Nickel
516-AG10D-ES
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RFQ
3,855
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - - 16 (2 x 8) Beryllium Copper Brass
5-1571551-2
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RFQ
1,703
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 40 (2 x 20) Beryllium Copper Nickel
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761
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 6 (2 x 3) Beryllium Copper Beryllium Copper
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1,927
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 18 (2 x 9) Beryllium Copper Beryllium Copper
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3,297
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) Tin-Lead 16 (2 x 8) Beryllium Copper Beryllium Copper