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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Material - Post
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	24-C300-31	RFQ VIEW	PDF RFQ	3,687 In-stock	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	24 (2 x 12)	Beryllium Copper	Brass
	24-C300-21	RFQ VIEW	PDF RFQ	3,856 In-stock	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	24 (2 x 12)	Beryllium Copper	Brass
	24-C212-31	RFQ VIEW	PDF RFQ	1,087 In-stock	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	24 (2 x 12)	Beryllium Copper	Brass
	24-C212-21	RFQ VIEW	PDF RFQ	2,778 In-stock	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	24 (2 x 12)	Beryllium Copper	Brass
	24-C182-31	RFQ VIEW	PDF RFQ	612 In-stock	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	24 (2 x 12)	Beryllium Copper	Brass
	24-C182-21	RFQ VIEW	PDF RFQ	3,656 In-stock	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	24 (2 x 12)	Beryllium Copper	Brass
	24-C182-11H	RFQ VIEW	PDF RFQ	3,108 In-stock	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	24 (2 x 12)	Beryllium Copper	Brass
	24-C300-11	RFQ VIEW	PDF RFQ	2,581 In-stock	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	24 (2 x 12)	Beryllium Copper	Brass
	24-C212-11	RFQ VIEW	PDF RFQ	2,199 In-stock	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	24 (2 x 12)	Beryllium Copper	Brass
	24-C182-11	RFQ VIEW	PDF RFQ	3,990 In-stock	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	24 (2 x 12)	Beryllium Copper	Brass

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