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27 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
2,335
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,410
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,503
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 146 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
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|
VIEW |
1,368
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 146 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
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|
VIEW |
829
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 6POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
2,092
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,966
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 121 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,126
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,969
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,463
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,604
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
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|
VIEW |
703
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,775
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,468
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,235
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 612 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
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|
VIEW |
2,590
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
884
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,727
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,710
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
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|
VIEW |
1,431
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,899
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,975
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
697
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,079
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
771
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,946
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,385
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
