Sockets for ICs, Transistors Products For Sale - PDF - Connectors, Interconnects -

Applied Filters :

11 results

Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Material - Post
GLOBAL STOCKS
	16-C280-31	RFQ VIEW	PDF RFQ	2,009 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-C280-21	RFQ VIEW	PDF RFQ	3,704 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-C195-31	RFQ VIEW	PDF RFQ	3,219 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-C195-21	RFQ VIEW	PDF RFQ	1,252 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-1508-31	RFQ VIEW	PDF RFQ	3,759 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-1508-21	RFQ VIEW	PDF RFQ	747 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-C280-11H	RFQ VIEW	PDF RFQ	1,334 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-C195-11	RFQ VIEW	PDF RFQ	1,713 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	516-AG10D-ES	RFQ VIEW	PDF RFQ	3,855 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD		500	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	-	0.100" (2.54mm)	Gold	-	16 (2 x 8)	Beryllium Copper	Brass
	16-C280-11	RFQ VIEW	PDF RFQ	859 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	516-AG10D	RFQ VIEW	PDF RFQ	3,052 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD		500	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	-	0.100" (2.54mm)	Gold	-	16 (2 x 8)	Beryllium Copper	Brass

1 / 1

＜Prev Next＞