Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,851
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Preci-Dip CONN IC DIP SOCKET 64POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 64 (2 x 32) Beryllium Copper - Brass
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3,947
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Preci-Dip CONN IC DIP SOCKET 64POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 64 (2 x 32) Beryllium Copper - Brass
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1,722
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Preci-Dip CONN IC DIP SOCKET 52POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 52 (2 x 26) Beryllium Copper - Brass
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1,744
In-stock
Preci-Dip CONN IC DIP SOCKET 50POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
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2,329
In-stock
Preci-Dip CONN IC DIP SOCKET 64POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 64 (2 x 32) Beryllium Copper - Brass
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920
In-stock
Preci-Dip CONN IC DIP SOCKET 52POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 52 (2 x 26) Beryllium Copper - Brass
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1,167
In-stock
Preci-Dip CONN IC DIP SOCKET 50POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
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682
In-stock
Preci-Dip CONN IC DIP SOCKET 50POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
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2,045
In-stock
Preci-Dip CONN IC DIP SOCKET 64POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 64 (2 x 32) Beryllium Copper - Brass
110-43-964-41-001000
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1,150
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-44-964-41-001000
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3,333
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS TIN 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,823
In-stock
Preci-Dip CONN IC DIP SOCKET 50POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
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3,490
In-stock
Preci-Dip CONN IC DIP SOCKET 52POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 52 (2 x 26) Beryllium Copper - Brass
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771
In-stock
Preci-Dip CONN IC DIP SOCKET 64POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 64 (2 x 32) Beryllium Copper - Brass
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3,268
In-stock
Preci-Dip CONN IC DIP SOCKET 50POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
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3,618
In-stock
Preci-Dip CONN IC DIP SOCKET 52POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 52 (2 x 26) Beryllium Copper - Brass
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RFQ
1,074
In-stock
Preci-Dip CONN IC DIP SOCKET 64POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 64 (2 x 32) Beryllium Copper - Brass
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RFQ
1,268
In-stock
Preci-Dip CONN IC DIP SOCKET 50POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
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RFQ
2,667
In-stock
Preci-Dip CONN IC DIP SOCKET 52POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 52 (2 x 26) Beryllium Copper - Brass
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RFQ
3,629
In-stock
Preci-Dip CONN IC DIP SOCKET 50POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
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RFQ
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RFQ
1,843
In-stock
Preci-Dip CONN IC DIP SOCKET 64POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 64 (2 x 32) Beryllium Copper - Brass
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RFQ
2,370
In-stock
Preci-Dip CONN IC DIP SOCKET 52POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 52 (2 x 26) Beryllium Copper - Brass
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RFQ
3,064
In-stock
Preci-Dip CONN IC DIP SOCKET 52POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 52 (2 x 26) Beryllium Copper - Brass
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RFQ
787
In-stock
Preci-Dip CONN IC DIP SOCKET 50POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
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RFQ
1,877
In-stock
Preci-Dip CONN IC DIP SOCKET 50POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
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RFQ
3,571
In-stock
Preci-Dip CONN IC DIP SOCKET 64POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 64 (2 x 32) Beryllium Copper - Brass
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RFQ
1,592
In-stock
Preci-Dip CONN IC DIP SOCKET 52POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 52 (2 x 26) Beryllium Copper - Brass
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RFQ
2,014
In-stock
Preci-Dip CONN IC DIP SOCKET 50POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
123-43-964-41-001000
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RFQ
2,228
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
123-43-950-41-001000
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RFQ
683
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy