Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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665
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 612 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,851
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Preci-Dip CONN IC DIP SOCKET 64POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 64 (2 x 32) Beryllium Copper - Brass
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1,722
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Preci-Dip CONN IC DIP SOCKET 52POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 52 (2 x 26) Beryllium Copper - Brass
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1,744
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Preci-Dip CONN IC DIP SOCKET 50POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
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920
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Preci-Dip CONN IC DIP SOCKET 52POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 52 (2 x 26) Beryllium Copper - Brass
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1,167
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Preci-Dip CONN IC DIP SOCKET 50POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
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682
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Preci-Dip CONN IC DIP SOCKET 50POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
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2,045
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Preci-Dip CONN IC DIP SOCKET 64POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 64 (2 x 32) Beryllium Copper - Brass
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2,823
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Preci-Dip CONN IC DIP SOCKET 50POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
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771
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Preci-Dip CONN IC DIP SOCKET 64POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 64 (2 x 32) Beryllium Copper - Brass
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1,074
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Preci-Dip CONN IC DIP SOCKET 64POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 64 (2 x 32) Beryllium Copper - Brass
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1,843
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Preci-Dip CONN IC DIP SOCKET 64POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 64 (2 x 32) Beryllium Copper - Brass
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3,064
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Preci-Dip CONN IC DIP SOCKET 52POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 52 (2 x 26) Beryllium Copper - Brass
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1,703
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Preci-Dip CONN IC DIP SOCKET 64POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 64 (2 x 32) Beryllium Copper - Brass
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3,169
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Preci-Dip CONN IC DIP SOCKET 52POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 52 (2 x 26) Beryllium Copper - Brass
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2,886
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Preci-Dip CONN IC DIP SOCKET 52POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 52 (2 x 26) Beryllium Copper - Brass
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1,977
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Preci-Dip CONN IC DIP SOCKET 50POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
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3,671
In-stock
Preci-Dip CONN IC DIP SOCKET 50POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
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2,064
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Preci-Dip CONN IC DIP SOCKET 52POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 52 (2 x 26) Beryllium Copper - Brass