- Series :
- Termination :
- Features :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (2)
- 11 (1 x 11) (1)
- 12 (1 x 12) (2)
- 13 (1 x 13) (1)
- 14 (1 x 14) (2)
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- 19 (1 x 19) (1)
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- 20 (2 x 10) (3)
- 21 (1 x 21) (1)
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- 22 (2 x 11) (4)
- 23 (1 x 23) (1)
- 24 (1 x 24) (1)
- 24 (2 x 12) (7)
- 25 (1 x 25) (1)
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- 27 (1 x 27) (1)
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- 28 (2 x 14) (3)
- 29 (1 x 29) (1)
- 3 (1 x 3) (1)
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- 32 (1 x 32) (2)
- 32 (2 x 16) (3)
- 36 (2 x 18) (1)
- 4 (1 x 4) (2)
- 40 (2 x 20) (2)
- 42 (2 x 21) (1)
- 48 (2 x 24) (2)
- 5 (1 x 5) (2)
- 6 (1 x 6) (2)
- 6 (2 x 3) (2)
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- 7 (1 x 7) (2)
- 8 (1 x 8) (2)
- 8 (2 x 4) (3)
- 9 (1 x 9) (2)
- Applied Filters :
83 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
2,055
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 64POS GOLD | D8864 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.75" (19.05mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.070" (1.78mm) | Gold | Flash | Tin | 64 (2 x 32) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,774
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 32POS GOLD | D26 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
634
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 28POS GOLD | D26 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 28 (2 x 14) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,564
In-stock
|
Harwin Inc. | CONN SOCKET SIP 12POS GOLD | D01-995 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 12 (1 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,025
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
2,302
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
2,895
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | D0 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
1,394
In-stock
|
Harwin Inc. | CONN SOCKET SIP 16POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 16 (1 x 16) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,254
In-stock
|
Harwin Inc. | CONN SOCKET SIP 15POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 15 (1 x 15) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
829
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 6POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
2,473
In-stock
|
Harwin Inc. | CONN SOCKET SIP 5POS GOLD | D01-995 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 5 (1 x 5) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
2,435
In-stock
|
Harwin Inc. | CONN SOCKET SIP 13POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 13 (1 x 13) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
2,297
In-stock
|
Harwin Inc. | CONN SOCKET SIP 14POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 14 (1 x 14) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
1,741
In-stock
|
Harwin Inc. | CONN SOCKET SIP 4POS GOLD | D01-995 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (1 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
3,955
In-stock
|
Harwin Inc. | CONN SOCKET SIP 9POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 9 (1 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
2,179
In-stock
|
Harwin Inc. | CONN SOCKET SIP 11POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 11 (1 x 11) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,981
In-stock
|
Harwin Inc. | CONN SOCKET SIP 12POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (1 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,859
In-stock
|
Harwin Inc. | CONN SOCKET SIP 10POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (1 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
2,930
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 42POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 42 (2 x 21) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,103
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 48POS GOLD | D0 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
616
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 48POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 48 (2 x 24) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
1,101
In-stock
|
Harwin Inc. | CONN SOCKET SIP 32POS GOLD | D01-995 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (1 x 32) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
1,847
In-stock
|
Harwin Inc. | CONN SOCKET SIP 20POS GOLD | D01-995 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (1 x 20) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
692
In-stock
|
Harwin Inc. | CONN SOCKET SIP 20POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 20 (1 x 20) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
2,251
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 32POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,660
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D0 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
2,398
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 22POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 22 (2 x 11) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
3,374
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 36POS GOLD | D0 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 36 (2 x 18) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,905
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 22POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 22 (2 x 11) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
1,909
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 22POS GOLD | D0 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
