Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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927
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Aries Electronics CONN SOCKET SIP 20POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
346-43-120-41-013000
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3,988
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,907
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Aries Electronics CONN SOCKET SIP 20POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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3,490
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Aries Electronics CONN SOCKET SIP 20POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
346-93-120-41-013000
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1,970
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,630
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS GOLD 324 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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1,276
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Aries Electronics CONN SOCKET SIP 20POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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800
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Aries Electronics CONN SOCKET SIP 20POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
D01-9952042
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1,847
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Harwin Inc. CONN SOCKET SIP 20POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper 196.9µin (5.00µm) Brass
D01-9972042
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692
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Harwin Inc. CONN SOCKET SIP 20POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 20 (1 x 20) Beryllium Copper 196.9µin (5.00µm) Brass
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2,631
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS GOLD 310 Active Tube -55°C ~ 125°C Through Hole Solder SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-99-120-41-013000
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1,084
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS TIN-LEAD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
220-2600-00-0602
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3,468
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3M CONN SOCKET SIP ZIF 20POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - Gold 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper