Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
224-5809-00-0602
RFQ
VIEW
RFQ
1,283
In-stock
3M CONN SOCKET SIP ZIF 24POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 24 (1 x 24) Beryllium Copper
232-2601-00-0602
RFQ
VIEW
RFQ
792
In-stock
3M CONN SOCKET SIP ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 32 (1 x 32) Beryllium Copper
236-6225-00-0602
RFQ
VIEW
RFQ
3,826
In-stock
3M CONN SOCKET SIP ZIF 36POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 36 (1 x 36) Beryllium Copper
220-2600-00-0602
RFQ
VIEW
RFQ
3,468
In-stock
3M CONN SOCKET SIP ZIF 20POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 20 (1 x 20) Beryllium Copper
210-2599-00-0602
RFQ
VIEW
RFQ
3,164
In-stock
3M CONN SOCKET SIP ZIF 10POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 10 (1 x 10) Beryllium Copper