Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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738
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Aries Electronics CONN IC DIP SOCKET 38POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 38 (2 x 19) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,731
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Aries Electronics CONN IC DIP SOCKET 36POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 36 (2 x 18) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,011
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Aries Electronics CONN IC DIP SOCKET 24POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,574
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Mill-Max Manufacturing Corp. CONN ZIG-ZAG 16POS GOLD 410 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, Left Stackable Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,425
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Aries Electronics CONN IC DIP SOCKET 10POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (2 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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724
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (2 x 7) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,073
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Aries Electronics CONN IC DIP SOCKET 8POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 8 (2 x 4) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,870
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Aries Electronics CONN IC DIP SOCKET 22POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 22 (2 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,485
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Aries Electronics CONN IC DIP SOCKET 28POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 28 (2 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,861
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (2 x 7) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,656
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Aries Electronics CONN IC DIP SOCKET 30POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 30 (2 x 15) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,829
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Aries Electronics CONN IC DIP SOCKET 16POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (2 x 8) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,987
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Mill-Max Manufacturing Corp. CONN ZIG-ZAG 28POS GOLD 410 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, Right Stackable Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
20-3501-30
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1,685
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Aries Electronics CONN IC DIP SOCKET 20POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 20 (2 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,540
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Aries Electronics CONN IC DIP SOCKET 20POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 20 (2 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,167
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (2 x 7) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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850
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Aries Electronics CONN IC DIP SOCKET 8POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 8 (2 x 4) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,685
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Aries Electronics CONN IC DIP SOCKET 8POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 8 (2 x 4) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,989
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Aries Electronics CONN IC DIP SOCKET 48POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 48 (2 x 24) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,132
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Aries Electronics CONN IC DIP SOCKET 34POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 34 (2 x 17) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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987
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Aries Electronics CONN IC DIP SOCKET 32POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (2 x 16) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,483
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Aries Electronics CONN IC DIP SOCKET 22POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 22 (2 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,858
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Aries Electronics CONN IC DIP SOCKET 20POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 20 (2 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,255
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Aries Electronics CONN IC DIP SOCKET 18POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,937
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Aries Electronics CONN IC DIP SOCKET 40POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 40 (2 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,769
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Aries Electronics CONN IC DIP SOCKET 16POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (2 x 8) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,460
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Aries Electronics CONN IC DIP SOCKET 18POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,705
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Aries Electronics CONN IC DIP SOCKET 10POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (2 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
410-93-220-10-001000
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772
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Mill-Max Manufacturing Corp. CONN ZIG-ZAG 20POS GOLD 410 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, Left Stackable Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy