Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,904
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Preci-Dip CONN SOCKET PGA 361POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 361 (19 x 19) Beryllium Copper - Brass
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1,850
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Preci-Dip CONN SOCKET PGA 289POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 289 (17 x 17) Beryllium Copper - Brass
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2,419
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Preci-Dip CONN SOCKET PGA 441POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 441 (21 x 21) Beryllium Copper - Brass
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1,093
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Preci-Dip CONN SOCKET PGA 324POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 324 (18 x 18) Beryllium Copper - Brass
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1,640
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Preci-Dip CONN SOCKET PGA 441POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 441 (21 x 21) Beryllium Copper - Brass
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3,428
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Preci-Dip CONN SOCKET PGA 225POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 225 (15 x 15) Beryllium Copper - Brass
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2,342
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Preci-Dip CONN SOCKET PGA 289POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 289 (17 x 17) Beryllium Copper - Brass
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1,453
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Preci-Dip CONN SOCKET PGA 144POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 144 (12 x 12) Beryllium Copper - Brass
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738
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Aries Electronics CONN IC DIP SOCKET 38POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 38 (2 x 19) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,497
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Preci-Dip CONN SOCKET PGA 225POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 225 (15 x 15) Beryllium Copper - Brass
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1,731
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Aries Electronics CONN IC DIP SOCKET 36POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 36 (2 x 18) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,585
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Preci-Dip CONN SOCKET PGA 361POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 361 (19 x 19) Beryllium Copper - Brass
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2,175
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Preci-Dip CONN SOCKET PGA 169POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 169 (13 x 13) Beryllium Copper - Brass
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2,450
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Preci-Dip CONN SOCKET PGA 100POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 100 (10 x 10) Beryllium Copper - Brass
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1,011
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Aries Electronics CONN IC DIP SOCKET 24POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,535
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Preci-Dip CONN SOCKET PGA 121POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 121 (11 x 11) Beryllium Copper - Brass
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2,425
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Aries Electronics CONN IC DIP SOCKET 10POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (2 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,811
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Preci-Dip CONN SOCKET PGA 324POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 324 (18 x 18) Beryllium Copper - Brass
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724
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (2 x 7) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,073
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Aries Electronics CONN IC DIP SOCKET 8POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 8 (2 x 4) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,809
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Preci-Dip CONN SOCKET PGA 196POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 196 (14 x 14) Beryllium Copper - Brass
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2,728
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Preci-Dip CONN SOCKET PGA 256POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 256 (16 x 16) Beryllium Copper - Brass
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3,974
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Preci-Dip CONN SOCKET PGA 25POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 25 (5 x 5) Beryllium Copper - Brass
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3,269
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TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Tin 16 (1 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
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2,265
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Preci-Dip CONN SOCKET PGA 256POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 256 (16 x 16) Beryllium Copper - Brass
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1,870
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Aries Electronics CONN IC DIP SOCKET 22POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 22 (2 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,485
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Aries Electronics CONN IC DIP SOCKET 28POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 28 (2 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,861
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (2 x 7) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,656
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Aries Electronics CONN IC DIP SOCKET 30POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 30 (2 x 15) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,361
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Preci-Dip CONN SOCKET PGA 121POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 121 (11 x 11) Beryllium Copper - Brass