Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
2,485
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,834
In-stock
Aries Electronics CONN IC DIP SOCKET 34POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 34 (2 x 17) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,931
In-stock
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,498
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,220
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 10 (2 x 5) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,302
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,448
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,549
In-stock
Aries Electronics CONN IC DIP SOCKET 38POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 38 (2 x 19) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
784
In-stock
Aries Electronics CONN IC DIP SOCKET 30POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 30 (2 x 15) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
841
In-stock
Aries Electronics CONN IC DIP SOCKET 20POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,899
In-stock
Aries Electronics CONN IC DIP SOCKET 36POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 36 (2 x 18) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,156
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
765
In-stock
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,408
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,595
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 18 (2 x 9) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,291
In-stock
Aries Electronics CONN IC DIP SOCKET 20POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,790
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 10 (2 x 5) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,011
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
852
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,161
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,558
In-stock
Aries Electronics CONN IC DIP SOCKET 24POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,637
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,386
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 18 (2 x 9) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,696
In-stock
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,376
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,707
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Phosphor Bronze