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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Material - Post
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	12-6503-31	RFQ VIEW	PDF RFQ	3,940 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	12 (2 x 6)	Beryllium Copper	Phosphor Bronze
	12-6503-21	RFQ VIEW	PDF RFQ	2,710 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	12 (2 x 6)	Beryllium Copper	Phosphor Bronze
	12-3503-31	RFQ VIEW	PDF RFQ	2,048 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	12 (2 x 6)	Beryllium Copper	Phosphor Bronze
	12-3503-21	RFQ VIEW	PDF RFQ	865 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	12 (2 x 6)	Beryllium Copper	Phosphor Bronze

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