- Termination :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (17)
- 10 (2 x 5) (50)
- 11 (1 x 11) (7)
- 12 (1 x 12) (10)
- 12 (2 x 6) (15)
- 13 (1 x 13) (6)
- 14 (1 x 14) (9)
- 14 (2 x 7) (110)
- 15 (1 x 15) (11)
- 16 (1 x 16) (9)
- 16 (2 x 8) (81)
- 17 (1 x 17) (11)
- 18 (1 x 18) (9)
- 18 (2 x 9) (54)
- 19 (1 x 19) (9)
- 2 (1 x 2) (13)
- 20 (1 x 20) (61)
- 20 (2 x 10) (56)
- 21 (1 x 21) (7)
- 22 (1 x 22) (5)
- 22 (2 x 11) (18)
- 23 (1 x 23) (5)
- 24 (1 x 24) (6)
- 24 (2 x 12) (57)
- 25 (1 x 25) (23)
- 26 (1 x 26) (8)
- 26 (2 x 13) (11)
- 27 (1 x 27) (9)
- 28 (1 x 28) (8)
- 28 (2 x 14) (53)
- 29 (1 x 29) (7)
- 3 (1 x 3) (8)
- 30 (1 x 30) (16)
- 30 (2 x 15) (12)
- 31 (1 x 31) (7)
- 32 (1 x 32) (5)
- 32 (2 x 16) (38)
- 33 (1 x 33) (4)
- 34 (1 x 34) (19)
- 34 (2 x 17) (6)
- 35 (1 x 35) (7)
- 36 (1 x 36) (4)
- 36 (2 x 18) (10)
- 37 (1 x 37) (4)
- 38 (1 x 38) (4)
- 38 (2 x 19) (6)
- 39 (1 x 39) (4)
- 4 (1 x 4) (25)
- 40 (1 x 40) (6)
- 40 (2 x 20) (49)
- 48 (2 x 24) (8)
- 5 (1 x 5) (10)
- 50 (2 x 25) (4)
- 6 (1 x 6) (8)
- 6 (2 x 3) (16)
- 60 (2 x 30) (2)
- 64 (2 x 32) (4)
- 7 (1 x 7) (4)
- 8 (1 x 8) (26)
- 8 (2 x 4) (52)
- 9 (1 x 9) (15)
- Contact Material - Mating :
- Applied Filters :
1213 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
3,874
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,478
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PG | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,192
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,740
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,410
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,665
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,705
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,669
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGG | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,599
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,888
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,827
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PG | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,886
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
952
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,436
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,304
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,077
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
991
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
645
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,392
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
922
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,285
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,442
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,540
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
769
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,623
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,363
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,373
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,238
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,500
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,167
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass |