- Mounting Type :
- Features :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 192 (16 x 16) (3)
- 255 (16 x 16) (3)
- 256 (16 x 16) (3)
- 256 (20 x 20) (3)
- 272 (20 x 20) (3)
- 292 (20 x 20) (3)
- 352 (26 x 26) (3)
- 356 (26 x 26) (3)
- 357 (19 x 19) (3)
- 360 (19 x 19) (3)
- 388 (26 x 26) (3)
- 400 (20 x 20) (3)
- 420 (26 x 26) (3)
- 432 (31 x 31) (3)
- 456 (26 x 26) (3)
- 478 (26 x 26) (3)
- 480 (29 x 29) (3)
- 500 (30 x 30) (3)
- 504 (29 x 29) (3)
- 520 (31 x 31) (3)
- 560 (33 x 33) (3)
- 576 (30 x 30) (3)
- 600 (35 x 35) (3)
- 652 (35 x 35) (3)
- Applied Filters :
72 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
773
In-stock
|
Preci-Dip | CONN SOCKET BGA 652POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 652 (35 x 35) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,451
In-stock
|
Preci-Dip | CONN SOCKET BGA 600POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 600 (35 x 35) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,274
In-stock
|
Preci-Dip | CONN SOCKET BGA 576POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 576 (30 x 30) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,210
In-stock
|
Preci-Dip | CONN SOCKET BGA 560POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 560 (33 x 33) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,481
In-stock
|
Preci-Dip | CONN SOCKET BGA 652POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 652 (35 x 35) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,125
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,420
In-stock
|
Preci-Dip | CONN SOCKET BGA 520POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 520 (31 x 31) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,686
In-stock
|
Preci-Dip | CONN SOCKET BGA 504POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 504 (29 x 29) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,727
In-stock
|
Preci-Dip | CONN SOCKET BGA 500POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 500 (30 x 30) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,766
In-stock
|
Preci-Dip | CONN SOCKET BGA 600POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 600 (35 x 35) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,242
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,533
In-stock
|
Preci-Dip | CONN SOCKET BGA 480POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 480 (29 x 29) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
649
In-stock
|
Preci-Dip | CONN SOCKET BGA 478POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 478 (26 x 26) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,416
In-stock
|
Preci-Dip | CONN SOCKET BGA 576POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 576 (30 x 30) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,343
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,515
In-stock
|
Preci-Dip | CONN SOCKET BGA 456POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 456 (26 x 26) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,323
In-stock
|
Preci-Dip | CONN SOCKET BGA 560POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 560 (33 x 33) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
975
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,531
In-stock
|
Preci-Dip | CONN SOCKET BGA 272POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 272 (20 x 20) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,172
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 272 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,676
In-stock
|
Preci-Dip | CONN SOCKET BGA 256POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 256 (20 x 20) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,443
In-stock
|
Preci-Dip | CONN SOCKET BGA 256POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 256 (16 x 16) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,682
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 256 (16 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,409
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 256 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
737
In-stock
|
Preci-Dip | CONN SOCKET BGA 255POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 255 (16 x 16) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,877
In-stock
|
Preci-Dip | CONN SOCKET BGA 192POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 192 (16 x 16) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,721
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 192 (16 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,388
In-stock
|
Preci-Dip | CONN SOCKET BGA 360POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 360 (19 x 19) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,088
In-stock
|
Preci-Dip | CONN SOCKET BGA 292POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 292 (20 x 20) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,064
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 360 (19 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
