- Packaging :
- Type :
-
- BGA (25)
- DIP, 0.1" (2.54mm) Row Spacing (1)
- DIP, 0.2" (5.08mm) Row Spacing (3)
- DIP, 0.3" (7.62mm) Row Spacing (141)
- DIP, 0.4" (10.16mm) Row Spacing (4)
- DIP, 0.6" (15.24mm) Row Spacing (130)
- DIP, 0.75" (19.05mm) Row Spacing (2)
- DIP, 0.9" (22.86mm) Row Spacing (3)
- DIP, ZIF (ZIP) (4)
- PGA (62)
- PGA, ZIF (ZIP) (2)
- PLCC (33)
- SIP (16)
- Transistor, TO-100 (6)
- Transistor, TO-3 (16)
- Transistor, TO-5 (40)
- Zig-Zag (1)
- Zig-Zag, Left Stackable (2)
- Zig-Zag, Right Stackable (1)
- Zig-Zag, ZIF (ZIP) (12)
- Housing Material :
-
- Diallyl Phthalate (DAP) (3)
- Fluoropolymer (FP) (7)
- FR4 Epoxy Glass (50)
- Liquid Crystal Polymer (LCP) (9)
- Phenolic (1)
- Polyamide (PA), Nylon, Glass Filled (3)
- Polyamide (PA46), Nylon 4/6, Glass Filled (26)
- Polybutylene Terephthalate (PBT), Glass Filled (9)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (203)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (104)
- Polyester (8)
- Polysulfone (PSU), Glass Filled (15)
- Polytetrafluoroethylene (PTFE) (29)
- Thermoplastic (2)
- Thermoplastic, Glass Filled (4)
- Thermoplastic, Polyester (7)
- Pitch - Mating :
- Contact Finish - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (2)
- 10 (2 x 5) (16)
- 10 (Round) (6)
- 100 (10 x 10) (2)
- 12 (2 x 6) (12)
- 121 (11 x 11) (2)
- 14 (1 x 14) (1)
- 14 (2 x 7) (29)
- 144 (12 x 12) (4)
- 145 (15 x 15) (1)
- 15 (1 x 15) (2)
- 16 (1 x 16) (2)
- 16 (2 x 8) (31)
- 169 (13 x 13) (2)
- 18 (2 x 9) (18)
- 192 (16 x 16) (2)
- 196 (14 x 14) (2)
- 20 (1 x 20) (6)
- 20 (2 x 10) (21)
- 20 (4 x 5) (2)
- 20 (Round) (1)
- 22 (2 x 11) (7)
- 225 (15 x 15) (2)
- 24 (2 x 12) (34)
- 25 (5 x 5) (2)
- 255 (16 x 16) (2)
- 256 (16 x 16) (6)
- 256 (20 x 20) (2)
- 26 (2 x 13) (4)
- 272 (20 x 20) (2)
- 28 (2 x 14) (24)
- 28 (4 x 7) (3)
- 289 (17 x 17) (2)
- 292 (20 x 20) (2)
- 3 (1 x 3) (1)
- 3 (Oval) (12)
- 3 (Round) (14)
- 30 (2 x 15) (4)
- 32 (1 x 32) (1)
- 32 (2 x 16) (22)
- 32 (2 x 7, 2 x 9) (4)
- 324 (18 x 18) (2)
- 34 (1 x 34) (1)
- 34 (2 x 17) (3)
- 35 (1 x 17, 1 x 18) (4)
- 352 (26 x 26) (2)
- 356 (26 x 26) (2)
- 357 (19 x 19) (2)
- 36 (2 x 18) (6)
- 36 (6 x 6) (2)
- 360 (19 x 19) (2)
- 361 (19 x 19) (2)
- 388 (26 x 26) (2)
- 4 (Round) (12)
- 40 (2 x 20) (24)
- 400 (20 x 20) (6)
- 420 (26 x 26) (2)
- 432 (31 x 31) (2)
- 44 (4 x 11) (4)
- 441 (21 x 21) (2)
- 456 (26 x 26) (2)
- 480 (29 x 29) (2)
- 49 (7 x 7) (2)
- 5 (1 x 5) (1)
- 500 (30 x 30) (2)
- 504 (29 x 29) (2)
- 51 (1 x 25, 1 x 26) (4)
- 52 (4 x 13) (4)
- 520 (31 x 31) (2)
- 560 (33 x 33) (2)
- 576 (30 x 30) (2)
- 6 (2 x 3) (11)
- 600 (35 x 35) (2)
- 64 (2 x 32) (5)
- 64 (8 x 8) (2)
- 652 (35 x 35) (2)
- 68 (4 x 17) (3)
- 72 (2 x 36) (1)
- 8 (2 x 4) (23)
- 8 (Round) (17)
- 81 (9 x 9) (2)
- 84 (4 x 21) (4)
- 90 (2 x 45) (1)
- 99 (1 x 99) (1)
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
495 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||||
VIEW |
2,467
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 652 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,345
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 600 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,836
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 576 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,541
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 520 (31 x 31) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,295
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 560 (33 x 33) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,927
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 504 (29 x 29) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,073
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 500 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,486
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 480 (29 x 29) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,079
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 456 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
955
In-stock
|
Preci-Dip | CONN SOCKET PGA 400POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | 400 (20 x 20) | Beryllium Copper | Flash | Brass | ||||
VIEW |
1,231
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 432 (31 x 31) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,125
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 652 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,593
In-stock
|
Preci-Dip | CONN SOCKET PGA 400POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | 400 (20 x 20) | Beryllium Copper | Flash | Brass | ||||
VIEW |
3,763
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 420 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,371
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 400 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,242
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 600 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
849
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 388 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,343
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 576 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
975
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 560 (33 x 33) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,172
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 272 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,682
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 256 (16 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,409
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 256 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,721
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 192 (16 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,880
In-stock
|
TE Connectivity AMP Connectors | CONN TRANSIST TO-3 3POS GOLD | 8060 | Active | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Polytetrafluoroethylene (PTFE) | - | Gold | - | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | ||||
VIEW |
3,079
In-stock
|
3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
VIEW |
1,594
In-stock
|
3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
VIEW |
3,064
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 360 (19 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,408
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 357 (19 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,235
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 356 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
774
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 352 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass |