Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post
GLOBAL STOCKS
228-7396-55-1902
RFQ
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RFQ
1,560
In-stock
3M CONN SOCKET SOIC 28POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame SOIC Polyethersulfone (PES), Glass Filled - Gold 28 (2 x 14) Beryllium Copper 30.0µin (0.76µm)
228-7474-55-1902
RFQ
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RFQ
3,100
In-stock
3M CONN SOCKET SOIC 28POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame SOIC Polyethersulfone (PES), Glass Filled - Gold 28 (2 x 14) Beryllium Copper 30.0µin (0.76µm)