Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
A28-LCG-T-R
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2,964
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Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold - Gold 28 (2 x 14) - - -
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3,885
In-stock
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 28POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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3,264
In-stock
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 28POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
BU280Z-178-HT
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RFQ
2,920
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On Shore Technology Inc. CONN IC DIP SOCKET 28POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 28 (2 x 14) Beryllium Copper Flash Brass
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RFQ
3,716
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 28POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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RFQ
924
In-stock
CNC Tech CONN IC DIP SOCKET 28POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 28 (2 x 14) Phosphor Bronze 60.0µin (1.52µm) Phosphor Bronze
245-28-1-06
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1,700
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CNC Tech CONN IC DIP SOCKET 28POS TIN - Active Tube -40°C ~ 105°C Through Hole, Kinked Pin Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 28 (2 x 14) Phosphor Bronze 60.0µin (1.52µm) Phosphor Bronze
1-2199299-2
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RFQ
3,240
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TE Connectivity AMP Connectors 28P,DIP SKT,600 CL,LDR,PB FREE Diplomate DL Active Bulk -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 28 (2 x 14) Phosphor Bronze 60.0µin (1.52µm) Nickel
243-28-1-06
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RFQ
2,794
In-stock
CNC Tech CONN IC DIP SOCKET 28POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 28 (2 x 14) Phosphor Bronze 100.0µin (2.54µm) Phosphor Bronze
ED28DT
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2,348
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On Shore Technology Inc. CONN IC DIP SOCKET 28POS TIN ED Active Tube -55°C ~ 110°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 28 (2 x 14) Phosphor Bronze 60.0µin (1.52µm) Phosphor Bronze