Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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1,700
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) 28 (2 x 14) Copper Alloy -
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3,884
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.6" (15.24mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) 28 (2 x 14) Beryllium Copper Beryllium Copper
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1,396
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Samtec Inc. CONN ADAPTER PLUG 28POS GOLD APA Active Bulk - Through Hole Solder Open Frame - Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 20.0µin (0.51µm) 28 (2 x 14) Phosphor Bronze Phosphor Bronze
4-1571552-9
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RFQ
3,899
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) 28 (2 x 14) Beryllium Copper Copper