Contact Finish - Mating :
Contact Finish - Post :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,583
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN 800 Obsolete Tube -55°C ~ 105°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin - - 28 (2 x 14) Copper Alloy - -
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RFQ
2,404
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN 800 Obsolete Tube - Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin - - 28 (2 x 14) Beryllium Copper - Brass
110-93-628-41-105000
RFQ
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RFQ
3,483
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-428-41-105000
RFQ
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RFQ
1,977
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-328-41-105000
RFQ
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RFQ
1,677
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
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RFQ
2,336
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
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RFQ
2,896
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
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RFQ
3,754
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
BU280Z-178-HT
RFQ
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RFQ
2,920
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 28POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 28 (2 x 14) Beryllium Copper Flash Brass
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RFQ
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RFQ
2,745
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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RFQ
VIEW
RFQ
1,677
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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RFQ
VIEW
RFQ
2,772
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 110 Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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RFQ
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RFQ
3,286
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 114 Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
114-87-328-41-134161
RFQ
VIEW
RFQ
1,522
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper - Brass
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RFQ
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RFQ
2,329
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 114 Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
110-87-428-41-105101
RFQ
VIEW
RFQ
1,399
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper - Brass
110-87-328-41-105101
RFQ
VIEW
RFQ
2,783
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper - Brass
110-87-628-41-105161
RFQ
VIEW
RFQ
2,013
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper - Brass
110-87-328-41-105161
RFQ
VIEW
RFQ
3,864
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper - Brass
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RFQ
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RFQ
2,283
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
114-83-628-41-117101
RFQ
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RFQ
1,348
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
114-83-428-41-117101
RFQ
VIEW
RFQ
600
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
1,097
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
114-83-328-41-117101
RFQ
VIEW
RFQ
1,826
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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RFQ
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RFQ
3,504
In-stock
CNC Tech CONN IC DIP SOCKET 28POS GOLD - Active Tube -40°C ~ 105°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
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RFQ
2,596
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS TIN iCF Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Beryllium Copper - Beryllium Copper
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RFQ
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RFQ
1,015
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 110 Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper - Brass
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RFQ
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RFQ
1,961
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 110 Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper - Brass
ED028PLCZ-SM-N
RFQ
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RFQ
3,582
In-stock
On Shore Technology Inc. CONN SOCKET PLCC 28POS ED Active Tube -55°C ~ 105°C Surface Mount Solder Closed Frame PLCC Polyphenylene Sulfide (PPS) 0.050" (1.27mm) - - - 28 (2 x 14) Phosphor Bronze - Phosphor Bronze
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RFQ
3,146
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS TIN iCF Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Beryllium Copper - Beryllium Copper