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13 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
1,749
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
2,910
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,977
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
840
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
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|
VIEW |
3,922
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
3,639
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
3,149
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
1,430
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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|
VIEW |
1,370
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
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|
VIEW |
1,733
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
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|
VIEW |
3,610
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
3,240
In-stock
|
TE Connectivity AMP Connectors | 28P,DIP SKT,600 CL,LDR,PB FREE | Diplomate DL | Active | Bulk | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 28 (2 x 14) | Phosphor Bronze | 60.0µin (1.52µm) | Nickel | |||
|
VIEW |
965
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 28 (2 x 14) | Phosphor Bronze | - | Brass, Copper | |||
