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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
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	28-6513-11H	RFQ VIEW	PDF RFQ	827 In-stock	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	28 (2 x 14)	Beryllium Copper	10.0µin (0.25µm)	Brass
	28-3513-10	RFQ VIEW	PDF RFQ	1,702 In-stock	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass
	28-6513-10H	RFQ VIEW	PDF RFQ	1,140 In-stock	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass
	28-3513-10H	RFQ VIEW	PDF RFQ	692 In-stock	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass
	28-3513-11	RFQ VIEW	PDF RFQ	3,653 In-stock	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	28 (2 x 14)	Beryllium Copper	10.0µin (0.25µm)	Brass
	28-6513-11	RFQ VIEW	PDF RFQ	2,945 In-stock	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	28 (2 x 14)	Beryllium Copper	10.0µin (0.25µm)	Brass
	28-6513-10	RFQ VIEW	PDF RFQ	3,944 In-stock	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass
	28-6513-10T	RFQ VIEW	PDF RFQ	1,369 In-stock	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass
	28-3513-11H	RFQ VIEW	PDF RFQ	2,751 In-stock	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	28 (2 x 14)	Beryllium Copper	10.0µin (0.25µm)	Brass
	28-3513-10T	RFQ VIEW	PDF RFQ	2,119 In-stock	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass

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