Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
AR18-HZL/07-TT
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2,381
In-stock
Assmann WSW Components CONN IC DIP SOCKET 18POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,312
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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862
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,738
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,142
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-318-41-105000
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3,510
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-318-41-801000
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1,959
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
AR18-HZL/07-TT-R
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2,028
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Assmann WSW Components CONN IC DIP SOCKET 18POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
299-43-318-10-001000
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2,668
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-93-318-10-001000
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RFQ
1,297
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
758
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,986
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
614-93-318-31-012000
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RFQ
862
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-318-41-001000
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RFQ
3,481
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,069
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 101 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-318-41-605000
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RFQ
1,295
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,807
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-318-41-001000
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RFQ
3,737
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
116-93-318-41-007000
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RFQ
2,502
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-43-318-11-001000
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RFQ
2,143
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-43-318-41-801000
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RFQ
2,550
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-93-618-10-002000
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RFQ
3,498
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-93-318-41-003000
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RFQ
1,385
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-318-41-001000
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RFQ
3,216
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-43-618-10-002000
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VIEW
RFQ
3,731
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-318-41-003000
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RFQ
1,379
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
614-43-318-31-012000
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RFQ
1,386
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-93-318-41-001000
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RFQ
2,640
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-93-318-11-001000
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RFQ
2,635
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-318-41-801000
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RFQ
3,885
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 10.0µin (0.25µm) Brass Alloy