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14 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
VIEW |
1,890
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
3,417
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 14POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,387
In-stock
|
3M | CONN IC DIP SOCKET 14POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 14 (2 x 7) | Beryllium Copper | Flash | Brass | ||||
VIEW |
3,743
In-stock
|
3M | CONN IC DIP SOCKET 14POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 14 (2 x 7) | Beryllium Copper | Flash | Brass | ||||
VIEW |
2,544
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 14 (2 x 7) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
VIEW |
986
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | Vertisockets™ 800 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,870
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 14POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
1,628
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 14POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
2,835
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 14 (2 x 7) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
VIEW |
3,643
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | 800 | Obsolete | Tube | - | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | - | 14 (2 x 7) | Beryllium Copper | - | Brass | ||||
VIEW |
3,530
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 14 (2 x 7) | Beryllium Copper | 25.0µin (0.63µm) | Beryllium Copper | ||||
VIEW |
2,605
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | - | Obsolete | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Gold | 14 (2 x 7) | Beryllium Copper | 5.00µin (0.127µm) | Brass | ||||
VIEW |
2,146
In-stock
|
3M | CONN IC DIP SOCKET 14POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 14 (2 x 7) | Beryllium Copper | Flash | Brass | ||||
VIEW |
1,197
In-stock
|
3M | CONN IC DIP SOCKET 14POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 14 (2 x 7) | Beryllium Copper | Flash | Brass |