Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
2-640361-4
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3,285
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 24 (2 x 12) Beryllium Copper Beryllium Copper
6-1437535-3
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1,771
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 8POS GOLD 500 Obsolete Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (1 x 8) Beryllium Copper Beryllium Copper
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RFQ
1,989
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (2 x 10) Beryllium Copper Beryllium Copper
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RFQ
1,361
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper Beryllium Copper
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1,719
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1207POS GOLD - Active Tray -55°C ~ 110°C Surface Mount Solder Closed Frame LGA Thermoplastic 0.043" (1.09mm) Gold - - 1207 (33 x 34) Beryllium Copper -
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2,617
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1207POS GOLD - Active Tray -55°C ~ 110°C Surface Mount Solder Closed Frame LGA Thermoplastic 0.043" (1.09mm) Gold - - 1207 (33 x 34) Beryllium Copper -
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RFQ
2,805
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 20 (2 x 10) Beryllium Copper Brass
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RFQ
3,204
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 16 (2 x 8) Beryllium Copper Brass
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RFQ
1,845
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 16 (1 x 16) Beryllium Copper Brass
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RFQ
3,537
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 10 (1 x 10) Beryllium Copper Brass
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RFQ
881
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 7POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 7 (1 x 7) Beryllium Copper Brass
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RFQ
856
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 14 (2 x 7) Beryllium Copper Brass
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RFQ
2,251
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Tube - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (1 x 10) Beryllium Copper Brass