Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,201
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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3,859
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Harwin Inc. CONN SOCKET SIP 10POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
510-AG90D-10
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3,203
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 500 Active Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 10 (1 x 10) Beryllium Copper - Beryllium Copper
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3,428
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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1,597
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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1,265
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
10-0511-11
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3,263
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Aries Electronics CONN SOCKET SIP 10POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,790
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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3,959
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 10POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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3,947
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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1,487
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 10POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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2,914
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 10POS GOLD 310 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-2599-00-0602
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3,164
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3M CONN SOCKET SIP ZIF 10POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (1 x 10) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper