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11 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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VIEW |
1,776
In-stock
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Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 12 (2 x 6) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,833
In-stock
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Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 12 (2 x 6) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,913
In-stock
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Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 12 (2 x 6) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,504
In-stock
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Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 12 (2 x 6) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,460
In-stock
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Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 12 (2 x 6) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,518
In-stock
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Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 12 (2 x 6) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,022
In-stock
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Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 12 (2 x 6) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,148
In-stock
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Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 12 (2 x 6) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,561
In-stock
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Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 12 (2 x 6) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,509
In-stock
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Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 12 (2 x 6) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,422
In-stock
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Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 12 (2 x 6) | Beryllium Copper | 10.0µin (0.25µm) | Brass |