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64 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW |
2,085
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,485
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
968
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,252
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,081
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,670
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
701
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,482
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,898
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
943
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,016
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
658
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,811
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,261
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,372
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,463
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,982
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,267
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,566
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,944
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,819
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,359
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,911
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,083
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
664
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
966
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,564
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,034
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,601
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,429
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
