Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,593
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-99-310-41-001000
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2,760
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,692
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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935
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
714-43-210-31-018000
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1,121
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (2 x 5) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
110-13-310-41-001000
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1,171
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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1,695
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-210-41-001000
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2,944
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-99-210-41-001000
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1,351
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-310-41-001000
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1,719
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-210-41-105000
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RFQ
770
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,745
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-210-41-001000
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3,638
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,434
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,135
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,883
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-310-41-001000
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3,792
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,060
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 612 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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776
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,170
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,147
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,821
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,528
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,561
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-210-41-001000
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2,403
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
111-93-210-41-001000
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3,181
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,049
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
116-43-210-41-006000
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2,885
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy