- Part Status :
- Mounting Type :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (2 x 5) (1)
- 100 (10 x 10) (2)
- 12 (2 x 6) (1)
- 14 (2 x 7) (1)
- 16 (2 x 8) (2)
- 18 (2 x 9) (2)
- 20 (2 x 10) (3)
- 22 (2 x 11) (1)
- 24 (2 x 12) (2)
- 26 (2 x 13) (1)
- 28 (2 x 14) (2)
- 30 (2 x 15) (1)
- 32 (2 x 16) (2)
- 34 (2 x 17) (1)
- 36 (2 x 18) (1)
- 38 (2 x 19) (1)
- 4 (2 x 2) (1)
- 40 (2 x 20) (2)
- 42 (2 x 21) (1)
- 44 (2 x 22) (1)
- 46 (2 x 23) (1)
- 48 (2 x 24) (1)
- 50 (2 x 25) (1)
- 52 (2 x 26) (1)
- 54 (2 x 27) (1)
- 56 (2 x 28) (1)
- 58 (2 x 29) (1)
- 6 (2 x 3) (2)
- 60 (2 x 30) (1)
- 62 (2 x 31) (1)
- 64 (2 x 32) (1)
- 64 (8 x 8) (2)
- 8 (2 x 4) (3)
- Contact Material - Post :
- Applied Filters :
46 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
856
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole, Right Angle, Vertical | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 18 (2 x 9) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
2,839
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 40 (2 x 20) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
3,201
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 32 (2 x 16) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
3,884
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 28 (2 x 14) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
3,122
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 24 (2 x 12) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
3,705
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 20 (2 x 10) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
698
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 6 (2 x 3) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
3,430
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 16 (2 x 8) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
802
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 8 (2 x 4) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
3,394
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 8 (2 x 4) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
814
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 20 (2 x 10) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
2,997
In-stock
|
Preci-Dip | CONN SOCKET PGA 100POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 100 (10 x 10) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,968
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 54POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 54 (2 x 27) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
1,902
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 40POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
2,138
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 38POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 38 (2 x 19) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
622
In-stock
|
Preci-Dip | CONN SOCKET PGA 64POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 64 (8 x 8) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,168
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 36POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 36 (2 x 18) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
2,145
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
1,853
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
737
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 12POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 12 (2 x 6) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
1,837
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 62POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 62 (2 x 31) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
1,121
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
1,097
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 56POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 56 (2 x 28) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
2,844
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 42POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 42 (2 x 21) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
3,020
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 58POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 58 (2 x 29) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
2,233
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
2,643
In-stock
|
Preci-Dip | CONN SOCKET PGA 64POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 64 (8 x 8) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,432
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 26POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (2 x 13) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
3,763
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 44POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
VIEW |
1,774
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 16 (2 x 8) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy |