- Part Status :
- Operating Temperature :
- Termination :
- Type :
- Housing Material :
-
- Polyamide (PA46), Nylon 4/6 (4)
- Polyamide (PA46), Nylon 4/6, Glass Filled (113)
- Polybutylene Terephthalate (PBT), Glass Filled (4)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (6)
- Polyester, Glass Filled (4)
- Polyether Imide (PEI), Glass Filled (1)
- Polyetheretherketone (PEEK), Glass Filled (8)
- Polyphenylene Sulfide (PPS), Glass Filled (74)
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
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217 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
2,161
In-stock
|
3M | CONN IC DIP SOCKET ZIF 40POS GLD | OEM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Gold | 40 (2 x 20) | Beryllium Copper | 250.0µin (6.35µm) | Beryllium Copper | |||
|
VIEW |
3,434
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 516 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
2,658
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
2,107
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,138
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
|
VIEW |
3,259
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
3,354
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
2,831
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
3,847
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
2,874
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
1,057
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,816
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TINLEAD | 500 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | - | 40 (2 x 20) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,933
In-stock
|
3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
1,612
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,994
In-stock
|
3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
1,109
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
1,509
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
1,357
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,973
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,040
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,135
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,755
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,394
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,342
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,905
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,534
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
|
VIEW |
3,188
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
|
VIEW |
1,662
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
2,121
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
|
VIEW |
922
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
