- Part Status :
- Operating Temperature :
- Termination :
- Housing Material :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
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73 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
3,109
In-stock
|
On Shore Technology Inc. | CONN IC DIP SOCKET 64POS GOLD | SA | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Gold | 64 (2 x 32) | Beryllium Copper | 80.0µin (2.03µm) | Brass | |||
|
VIEW |
3,056
In-stock
|
On Shore Technology Inc. | CONN IC DIP SOCKET 64POS GOLD | SA | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,557
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 64POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,256
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 64POS TIN | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin | - | - | 64 (2 x 32) | Copper Alloy | - | - | |||
|
VIEW |
668
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 64POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
1,403
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
VIEW |
2,117
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,516
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
995
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
2,430
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
3,218
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
3,867
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
2,248
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
VIEW |
3,826
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
3,973
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
VIEW |
3,618
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
871
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
1,127
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 64POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 64 (2 x 32) | Beryllium Copper | 25.0µin (0.63µm) | Copper | |||
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|
VIEW |
2,111
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 64POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Gold | 64 (2 x 32) | Beryllium Copper | Flash | Copper | |||
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|
VIEW |
3,376
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
VIEW |
665
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 612 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
687
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
1,267
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,004
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
2,514
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,776
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,630
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 121 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
VIEW |
3,921
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,097
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
820
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
