Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,306
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Amphenol FCI CONN SOCKET SIP 11POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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2,205
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Amphenol FCI CONN SOCKET SIP 11POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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1,664
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Amphenol FCI CONN SOCKET SIP 11POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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1,814
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TE Connectivity AMP Connectors CONN SOCKET SIP 11POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 11 (1 x 11) Beryllium Copper - Beryllium Copper
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990
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TE Connectivity AMP Connectors CONN SOCKET SIP 11POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 11 (1 x 11) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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3,130
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TE Connectivity AMP Connectors CONN SOCKET SIP 11POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP - - Gold 10.0µin (0.25µm) 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper