Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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2,045
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Aries Electronics CONN IC DIP SOCKET 38POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 38 (2 x 19) Phosphor Bronze
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RFQ
1,541
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Aries Electronics CONN IC DIP SOCKET 36POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 36 (2 x 18) Phosphor Bronze
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RFQ
1,392
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Aries Electronics CONN IC DIP SOCKET 24POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 24 (2 x 12) Phosphor Bronze
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1,188
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze
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RFQ
2,460
In-stock
Aries Electronics CONN IC DIP SOCKET 32POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Phosphor Bronze
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2,020
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Aries Electronics CONN IC DIP SOCKET 30POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 30 (2 x 15) Phosphor Bronze
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RFQ
3,829
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
2,839
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 8 (2 x 4) Phosphor Bronze
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RFQ
2,105
In-stock
Aries Electronics CONN IC DIP SOCKET 22POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze
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RFQ
1,451
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Phosphor Bronze
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RFQ
1,461
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze
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RFQ
1,171
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze
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RFQ
1,985
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 12POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 12 (1 x 12) Phosphor Bronze
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RFQ
1,667
In-stock
Aries Electronics CONN IC DIP SOCKET 22POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze
ED032PLCZ
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1,974
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On Shore Technology Inc. CONN SOCKET PLCC 32POS TIN ED Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Tin - 32 (2 x 16) Phosphor Bronze
ED028PLCZ
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1,662
In-stock
On Shore Technology Inc. CONN SOCKET PLCC 28POS TIN ED Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Tin - 28 (2 x 14) Phosphor Bronze
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3,110
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Aries Electronics CONN IC DIP SOCKET 30POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 30 (2 x 15) Phosphor Bronze
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RFQ
1,821
In-stock
Aries Electronics CONN IC DIP SOCKET 36POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 36 (2 x 18) Phosphor Bronze
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RFQ
3,026
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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RFQ
1,821
In-stock
Aries Electronics CONN IC DIP SOCKET 34POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 34 (2 x 17) Phosphor Bronze
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RFQ
1,459
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 29POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 29 (1 x 29) Phosphor Bronze
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RFQ
2,919
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Phosphor Bronze
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RFQ
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RFQ
2,934
In-stock
Aries Electronics CONN IC DIP SOCKET 22POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze
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RFQ
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RFQ
1,967
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Aries Electronics CONN IC DIP SOCKET 38POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 38 (2 x 19) Phosphor Bronze
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RFQ
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RFQ
2,225
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Aries Electronics CONN IC DIP SOCKET 20POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (2 x 10) Phosphor Bronze
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RFQ
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RFQ
1,945
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 8 (2 x 4) Phosphor Bronze
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RFQ
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RFQ
687
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
641
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
1,455
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Aries Electronics CONN IC DIP SOCKET 8POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 8 (2 x 4) Phosphor Bronze
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RFQ
3,243
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 14POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 14 (1 x 14) Phosphor Bronze