- Operating Temperature :
- Termination :
- Housing Material :
-
- Polyamide (PA46), Nylon 4/6, Glass Filled (2)
- Polybutylene Terephthalate (PBT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (1)
- Polyester (4)
- Polyester, Glass Filled (1)
- Polyphenylene Sulfide (PPS), Glass Filled (4)
- Thermoplastic (2)
- Thermoplastic, Glass Filled (1)
- Thermoplastic, Polyester (4)
- Contact Finish - Mating :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
29 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||||
VIEW |
1,182
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | Flash | 18 (2 x 9) | Copper Alloy | 80.0µin (2.03µm) | Copper Alloy | ||||
VIEW |
2,860
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
3,872
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
1,711
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
3,956
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS GOLD | - | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | 18 (2 x 9) | - | - | - | ||||
VIEW |
3,360
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 18 (2 x 9) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | ||||
VIEW |
2,246
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 18 (2 x 9) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | ||||
VIEW |
1,624
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
2,772
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 18POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,156
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 18 (2 x 9) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | ||||
VIEW |
3,790
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS TINLEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | 18 (2 x 9) | Copper Alloy | - | - | ||||
VIEW |
3,755
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS | 500 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | - | - | 18 (2 x 9) | Copper Alloy | - | Copper Alloy | ||||
VIEW |
3,867
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | 18 (2 x 9) | Copper Alloy | - | - | ||||
VIEW |
2,938
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS TINLEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | 18 (2 x 9) | Copper Alloy | - | - | ||||
VIEW |
2,853
In-stock
|
3M | CONN IC DIP SOCKET 18POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 18 (2 x 9) | Beryllium Copper | Flash | Brass | ||||
VIEW |
2,178
In-stock
|
3M | CONN IC DIP SOCKET 18POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 18 (2 x 9) | Beryllium Copper | Flash | Brass | ||||
VIEW |
3,512
In-stock
|
3M | CONN IC DIP SOCKET 18POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 18 (2 x 9) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
2,852
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 18 (2 x 9) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | ||||
VIEW |
3,260
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | 18 (2 x 9) | - | - | - | ||||
VIEW |
2,381
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
1,656
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | - | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 18 (2 x 9) | Beryllium Copper | 29.5µin (0.75µm) | Brass | ||||
VIEW |
3,962
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS TIN | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 18 (2 x 9) | Beryllium Copper | - | Copper | ||||
VIEW |
2,326
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | 18 (2 x 9) | Beryllium Copper | - | Beryllium Copper | ||||
VIEW |
1,256
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | 18 (2 x 9) | Beryllium Copper | 25.0µin (0.63µm) | Copper | ||||
VIEW |
1,913
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | 18 (2 x 9) | Beryllium Copper | - | Beryllium Copper | ||||
VIEW |
3,225
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 18 (2 x 9) | Beryllium Copper | 20.0µin (0.51µm) | Copper | ||||
VIEW |
1,272
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 500 | Obsolete | - | - | Through Hole | - | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | 18 (2 x 9) | - | - | - | ||||
VIEW |
3,702
In-stock
|
3M | CONN IC DIP SOCKET 18POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 18 (2 x 9) | Beryllium Copper | Flash | Brass | ||||
VIEW |
2,652
In-stock
|
3M | CONN IC DIP SOCKET 18POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 18 (2 x 9) | Beryllium Copper | Flash | Brass |