- Part Status :
- Packaging :
- Termination :
- Housing Material :
-
- FR4 Epoxy Glass (48)
- Liquid Crystal Polymer (LCP) (1)
- Polyamide (PA46), Nylon 4/6 (99)
- Polyamide (PA46), Nylon 4/6, Glass Filled (255)
- Polybutylene Terephthalate (PBT), Glass Filled (15)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (167)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (28)
- Polyester (4)
- Polyester, Glass Filled (11)
- Pitch - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 1 (1 x 1) (2)
- 10 (1 x 10) (2)
- 10 (2 x 5) (18)
- 100 (15 x 15) (1)
- 11 (1 x 11) (2)
- 114 (13 x 13) (1)
- 12 (1 x 12) (2)
- 12 (2 x 6) (6)
- 121 (13 x 13) (1)
- 124 (13 x 13) (1)
- 13 (1 x 13) (2)
- 132 (13 x 13) (1)
- 132 (14 x 14) (2)
- 133 (14 x 14) (1)
- 14 (1 x 14) (3)
- 14 (2 x 7) (27)
- 144 (12 x 12) (1)
- 144 (15 x 15) (1)
- 145 (15 x 15) (1)
- 149 (15 x 15) (1)
- 15 (1 x 15) (4)
- 16 (1 x 16) (3)
- 16 (2 x 8) (33)
- 169 (17 x 17) (1)
- 17 (1 x 17) (2)
- 18 (1 x 18) (2)
- 18 (2 x 9) (20)
- 19 (1 x 19) (2)
- 191 (18 x 18) (1)
- 192 (16 x 16) (2)
- 2 (1 x 2) (4)
- 20 (1 x 20) (6)
- 20 (2 x 10) (28)
- 21 (1 x 21) (2)
- 22 (1 x 22) (2)
- 22 (2 x 11) (26)
- 225 (18 x 18) (1)
- 23 (1 x 23) (2)
- 24 (1 x 24) (2)
- 24 (2 x 12) (53)
- 241 (18 x 18) (1)
- 25 (1 x 25) (2)
- 255 (16 x 16) (2)
- 256 (16 x 16) (2)
- 256 (20 x 20) (2)
- 26 (1 x 26) (2)
- 26 (2 x 13) (4)
- 27 (1 x 27) (2)
- 272 (20 x 20) (2)
- 28 (1 x 28) (2)
- 28 (2 x 14) (49)
- 29 (1 x 29) (1)
- 292 (20 x 20) (2)
- 296 (19 x 19) (1)
- 3 (1 x 3) (3)
- 30 (1 x 30) (2)
- 30 (2 x 15) (8)
- 32 (2 x 16) (37)
- 34 (2 x 17) (4)
- 352 (26 x 26) (2)
- 356 (26 x 26) (2)
- 357 (19 x 19) (2)
- 36 (2 x 18) (10)
- 360 (19 x 19) (2)
- 361 (18 x 18) (1)
- 37 (10 x 10) (1)
- 38 (2 x 19) (4)
- 381 (18 x 18) (1)
- 388 (26 x 26) (2)
- 4 (1 x 4) (2)
- 4 (2 x 2) (6)
- 40 (2 x 20) (33)
- 400 (20 x 20) (2)
- 42 (2 x 21) (4)
- 420 (26 x 26) (2)
- 432 (31 x 31) (2)
- 456 (26 x 26) (2)
- 478 (26 x 26) (2)
- 48 (2 x 24) (8)
- 480 (29 x 29) (2)
- 5 (1 x 5) (2)
- 50 (2 x 25) (12)
- 500 (30 x 30) (2)
- 504 (29 x 29) (2)
- 52 (2 x 26) (8)
- 520 (31 x 31) (2)
- 56 (9 x 9) (1)
- 560 (33 x 33) (2)
- 576 (30 x 30) (2)
- 6 (1 x 6) (2)
- 6 (2 x 3) (13)
- 60 (2 x 30) (2)
- 600 (35 x 35) (2)
- 64 (1 x 64) (1)
- 64 (2 x 32) (9)
- 652 (35 x 35) (2)
- 68 (10 x 10) (1)
- 68 (11 x 11) (4)
- 69 (11 x 11) (2)
- 7 (1 x 7) (2)
- 72 (11 x 11) (1)
- 72 (2 x 36) (1)
- 8 (1 x 8) (2)
- 8 (2 x 4) (17)
- 84 (10 x 10) (1)
- 84 (13 x 13) (1)
- 9 (1 x 9) (2)
- Contact Material - Post :
- Applied Filters :
628 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
2,886
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 28POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
3,837
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 16POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
2,467
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,345
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,836
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,541
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 520 (31 x 31) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,295
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,927
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 504 (29 x 29) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,073
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 500 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,486
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 480 (29 x 29) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,232
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 478 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,079
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 456 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,231
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 432 (31 x 31) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,125
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,763
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 420 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,371
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 400 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,242
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
849
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 388 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,343
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
975
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,172
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 272 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,682
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 256 (16 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,409
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 256 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,721
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 192 (16 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,651
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PGA 132POS GOLD | 522 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 132 (14 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
2,189
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
741
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,064
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 360 (19 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,408
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 357 (19 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,235
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 356 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass |