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4 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
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GLOBAL STOCKS | |||||||||||||||||||||
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VIEW |
1,924
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 32 (1 x 32) | Beryllium Copper | |||
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VIEW |
2,390
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (1 x 32) | Beryllium Copper | |||
|
VIEW |
2,585
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (1 x 32) | Beryllium Copper | |||
|
VIEW |
1,873
In-stock
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Omron Electronics Inc-EMC Div | CONN IC SOCKET 32POS | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | Housing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | - | - | 32 (1 x 32) | Beryllium Copper |