Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
1,331
In-stock
Aries Electronics CONN SOCKET SIP 30POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (1 x 30) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,229
In-stock
Aries Electronics CONN SOCKET SIP 30POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (1 x 30) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,903
In-stock
Aries Electronics CONN SOCKET SIP 30POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (1 x 30) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,994
In-stock
Aries Electronics CONN SOCKET SIP 30POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (1 x 30) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,793
In-stock
Aries Electronics CONN SOCKET SIP 30POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (1 x 30) Beryllium Copper 10.0µin (0.25µm) Brass
346-43-130-41-013000
RFQ
VIEW
RFQ
3,820
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 30POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 30 (1 x 30) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-130-41-013000
RFQ
VIEW
RFQ
1,003
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 30POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 30 (1 x 30) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,588
In-stock
Harwin Inc. CONN SOCKET SIP 30POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 30 (1 x 30) Beryllium Copper 196.9µin (5.00µm) Brass