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8 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
1,980
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 20 (1 x 20) | Beryllium Copper | 29.5µin (0.75µm) | Brass | |||
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VIEW |
1,588
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
3,427
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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|
VIEW |
1,176
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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|
VIEW |
3,026
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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|
VIEW |
1,586
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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|
VIEW |
3,850
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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|
VIEW |
3,477
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 20 (1 x 20) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
