Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,185
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Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
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2,844
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,705
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,004
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,204
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 16 (2 x 8) Beryllium Copper - Brass
299-83-616-10-002101
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1,622
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Preci-Dip CONN IC DIP SOCKET 16POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 16 (2 x 8) Beryllium Copper - Brass
299-87-316-11-001101
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676
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Preci-Dip CONN IC DIP SOCKET 16POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 16 (2 x 8) Beryllium Copper - Brass
299-87-316-10-001101
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3,441
In-stock
Preci-Dip CONN IC DIP SOCKET 16POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 16 (2 x 8) Beryllium Copper - Brass
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2,085
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Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (2 x 8) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,549
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Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (2 x 8) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,909
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,808
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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3,709
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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1,109
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,467
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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3,721
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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3,902
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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3,295
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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3,074
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,368
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,060
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Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (2 x 8) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,924
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (2 x 8) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,597
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Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (2 x 8) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
16-823-90
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RFQ
2,583
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
299-43-316-11-001000
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RFQ
2,837
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-83-316-10-001101
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RFQ
2,989
In-stock
Preci-Dip CONN IC DIP SOCKET 16POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 16 (2 x 8) Beryllium Copper - Brass
299-83-316-11-001101
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RFQ
964
In-stock
Preci-Dip CONN IC DIP SOCKET 16POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 16 (2 x 8) Beryllium Copper - Brass
299-93-316-11-001000
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2,363
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-93-316-10-001000
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2,541
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
16-2820-90C
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2,220
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass