Number of Positions or Pins (Grid) :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
2,962
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,538
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,975
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze
10-2820-90T
RFQ
VIEW
RFQ
3,340
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,191
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 8 (2 x 4) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,086
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 8 (2 x 4) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,069
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 8 (2 x 4) Phosphor Bronze