Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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RFQ
1,816
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TINLEAD 500 Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) Tin-Lead - 40 (2 x 20) Beryllium Copper Brass
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RFQ
2,812
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN 500 Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper Brass
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726
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN 500 Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper Brass
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RFQ
2,337
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) Tin-Lead - 20 (2 x 10) Beryllium Copper Brass
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796
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) Tin-Lead - 32 (2 x 16) Beryllium Copper Brass