Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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1,816
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TINLEAD 500 Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - - 40 (2 x 20) Beryllium Copper Brass
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1,065
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS 500 Obsolete - - Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 40 (2 x 20) - -
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1,438
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS 500 Obsolete - - Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 40 (2 x 20) - -
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866
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 40 (2 x 20) Beryllium Copper Beryllium Copper
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634
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 40 (2 x 20) Beryllium Copper Beryllium Copper
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3,271
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 40 (2 x 20) Beryllium Copper Beryllium Copper
540-AG10D-ES
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RFQ
3,417
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 40 (2 x 20) Beryllium Copper Brass
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3,316
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 40 (2 x 20) Beryllium Copper Nickel
5-1571551-2
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1,703
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 40 (2 x 20) Beryllium Copper Nickel
3-1571550-2
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RFQ
1,743
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 40 (2 x 20) Beryllium Copper Beryllium Copper
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RFQ
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RFQ
1,457
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 40 (2 x 20) Beryllium Copper Nickel
540-AG11D-ES
RFQ
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RFQ
1,905
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Tin-Lead 40 (2 x 20) Copper Alloy Copper Alloy