Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,131
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 6 (2 x 3) Beryllium Copper - Brass
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2,948
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 6 (2 x 3) Beryllium Copper 25.0µin (0.63µm) Nickel
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2,151
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 6 (2 x 3) Beryllium Copper 25.0µin (0.63µm) Brass
506-AG11D-ESL-LF
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2,006
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 6 (2 x 3) Beryllium Copper Flash Nickel
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1,438
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 6 (2 x 3) Beryllium Copper - Beryllium Copper
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761
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 6 (2 x 3) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
506-AG11D-ES
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2,609
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 6 (2 x 3) Copper Alloy - Copper Alloy
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3,549
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Gold 6 (2 x 3) Copper Alloy - Copper Alloy
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2,037
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 6 (2 x 3) Copper Alloy - Copper Alloy
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1,577
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 6 (2 x 3) Beryllium Copper 47.2µin (1.20µm) Copper Alloy