Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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2,805
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 20.0µin (0.51µm) 20 (2 x 10) Beryllium Copper Brass
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760
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 20 (2 x 10) Beryllium Copper Beryllium Copper
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2,337
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 20 (2 x 10) Beryllium Copper Brass
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1,404
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - 20 (2 x 10) Beryllium Copper Nickel
7-1437531-8
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3,238
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - 20 (2 x 10) Copper Alloy Copper Alloy
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836
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold - 20 (2 x 10) Copper Alloy Copper Alloy
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3,311
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - 20 (2 x 10) Beryllium Copper Beryllium Copper
2-1571551-6
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RFQ
1,481
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold Flash 20 (2 x 10) Copper Alloy Copper Alloy
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RFQ
2,454
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 20 (2 x 10) Beryllium Copper Nickel
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RFQ
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RFQ
2,747
In-stock
TE Connectivity AMP Connectors DIP SOCKET T/H 20POS 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold - 20 (2 x 10) Copper Alloy Copper Alloy
8-1437531-6
RFQ
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RFQ
2,770
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 20 (2 x 10) Copper Alloy Copper Alloy
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RFQ
3,962
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - 20 (2 x 10) Beryllium Copper Brass