Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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774
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Obsolete - - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Beryllium Copper - Brass
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2,948
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 6 (2 x 3) Beryllium Copper 25.0µin (0.63µm) Nickel
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1,157
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Beryllium Copper 25.0µin (0.63µm) Nickel
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3,530
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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760
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 20 (2 x 10) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
9-1437535-1
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946
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper 25.0µin (0.63µm) Copper Alloy
2-1571550-3
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2,428
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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2,151
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 6 (2 x 3) Beryllium Copper 25.0µin (0.63µm) Brass
4-1571551-3
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2,317
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper 25.0µin (0.63µm) Nickel
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1,115
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 18 (2 x 9) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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719
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 18 (2 x 9) Beryllium Copper 25.0µin (0.63µm) Nickel
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761
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 6 (2 x 3) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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1,927
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 18 (2 x 9) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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2,454
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 20 (2 x 10) Beryllium Copper 25.0µin (0.63µm) Nickel
508-AG10D
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2,740
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Copper Alloy 25.0µin (0.63µm) Copper Alloy
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1,364
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 16 (2 x 8) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
508-AG11D-ES
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RFQ
1,394
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 8 (2 x 4) Copper Alloy - Copper Alloy
506-AG11D-ES
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2,609
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 6 (2 x 3) Copper Alloy - Copper Alloy
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2,037
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 6 (2 x 3) Copper Alloy - Copper Alloy
514-AG11D-ES
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RFQ
2,668
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Copper Alloy - Copper Alloy
2-1571550-2
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935
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
508-AG10D-ES
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RFQ
2,110
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Copper Alloy 25.0µin (0.63µm) Copper Alloy
4-1571551-4
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3,286
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 16 (2 x 8) Beryllium Copper 25.0µin (0.63µm) Nickel
516-AG11D
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RFQ
1,822
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 16 (2 x 8) Copper Alloy - Copper Alloy