Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
516-AG7D
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RFQ
1,773
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Gold 16 (2 x 8) Copper Alloy - Copper Alloy
5-1437530-2
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RFQ
1,933
In-stock
TE Connectivity AMP Connectors CONN IC SIP SOCKET 8POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder - SIP Polyester 0.100" (2.54mm) Gold - Tin-Lead 8 (1 x 8) Beryllium Copper - Brass
Default Photo
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RFQ
3,703
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 36POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 36 (2 x 18) Beryllium Copper - Brass
Default Photo
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RFQ
3,950
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 3POS GOLD 500 Obsolete Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 3 (1 x 3) Beryllium Copper - Beryllium Copper
Default Photo
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RFQ
3,067
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD 500 Obsolete Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 16 (1 x 16) Beryllium Copper - Beryllium Copper
6-1437535-3
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RFQ
1,771
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 8POS GOLD 500 Obsolete Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (1 x 8) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
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RFQ
1,103
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 2POS GOLD 500 Obsolete Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 2 (1 x 2) Beryllium Copper - Beryllium Copper
Default Photo
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RFQ
2,825
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Obsolete - - Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 28 (2 x 14) - - -
Default Photo
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RFQ
2,131
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 6 (2 x 3) Beryllium Copper - Brass
Default Photo
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RFQ
1,085
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 36POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 36 (2 x 18) Copper Alloy 25.0µin (0.63µm) Copper Alloy
Default Photo
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RFQ
1,441
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 22 (2 x 11) Beryllium Copper - Brass
2-1437531-2
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RFQ
2,587
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 14 (2 x 7) Copper Alloy - Copper Alloy
Default Photo
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RFQ
2,201
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 500 Obsolete Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 20 (1 x 20) Beryllium Copper - Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
774
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Obsolete - - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
2,805
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 20 (2 x 10) Beryllium Copper - Brass
Default Photo
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RFQ
2,948
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 6 (2 x 3) Beryllium Copper 25.0µin (0.63µm) Nickel
Default Photo
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RFQ
1,247
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 24 (2 x 12) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
Default Photo
RFQ
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RFQ
2,840
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 36POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 36 (2 x 18) Beryllium Copper - Brass
Default Photo
RFQ
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RFQ
2,326
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - - 18 (2 x 9) Beryllium Copper - Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,515
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 24 (2 x 12) Beryllium Copper Flash Nickel
4-1571551-8
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RFQ
3,557
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 24 (2 x 12) Beryllium Copper 25.0µin (0.63µm) Nickel
1-1437531-8
RFQ
VIEW
RFQ
778
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 14 (2 x 7) Copper Alloy - Copper Alloy
1-1437536-3
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RFQ
1,272
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Obsolete - - Through Hole - Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - - 18 (2 x 9) - - -
Default Photo
RFQ
VIEW
RFQ
1,157
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Beryllium Copper 25.0µin (0.63µm) Nickel
Default Photo
RFQ
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RFQ
3,530
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
522-AG10D
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RFQ
1,227
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 22 (2 x 11) Copper Alloy - Copper Alloy
7-1437529-6
RFQ
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RFQ
3,810
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 8 (2 x 4) Copper Alloy - Copper Alloy
Default Photo
RFQ
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RFQ
3,204
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 16 (2 x 8) Beryllium Copper - Brass
Default Photo
RFQ
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RFQ
1,471
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 500 Active Bulk - Through Hole Solder Closed Frame SIP - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
737
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 22 (2 x 11) Beryllium Copper 25.0µin (0.63µm) Nickel